ii-A3

Flexible high speed placement

ii-A3 deploys a pair of the new high-speed Pulsar heads, each on an independent axis, and adds proven Tornado turret technology that makes iineo+ the industry’s most flexible SMT placement machine. That Tornado head is on its own axis and is specified with eight nozzles. With those three heads working together, and placement optimised by our latest software, Atom 3 achieves rates up to 65,000 components per hour for devices from 01005 profile to 99mm². It is Europlacer’s most flexible machine ever.

Over five years in development, the Europlacer design team set out to engineer a new platform that combines very high placement speeds with our legendary placement flexibility and accuracy. As a result, they succeeded with the SMT high speed placement machine atom. Therefore, now it’s possible to have a high speed placement machine AND flexible solution – no compromise. Innovations in design aspects and use of materials in the structure of the high speed placement atom platform reduce weight in performance-critical areas, like the moving mass of gantries and placement heads. Extruded y-axis gantries trim 30% off the mass of their cast counterparts. With lightness comes agility, but also a potential for flex under the high accelerations demanded by six-figure placement rates.

High speed placement

ii-A3 uses 2 Pulsar Heads combined with our proven Tornado Head and will provide speed of up to 65,000cph while catering for the complete range of SMT devices up to 34mm in height, and can even handle through hole devices with its gripping nozzle capability. Most importantly, Atom is the first Europlacer SMT platform to feature a new intelligent conveyor system. This patented technology eliminates mechanical board stops. Instead, atom machines can stop the board at any position under software control. In short, it delivers another incremental step in placement performance by automatically optimising head travel paths during pick and place cycles.

Features / Benefits

  • 264 x 8mm feeders
  • up to 5 internal Jedec trays
  • Component testing capability – with independently verifiable calibration (UKAS / NIST / PTB… etc.) 
  • Dispensing – Archimedes or air/time for glue or solder paste 
  • Every nozzle position can place all and any component types, for real line balancing and no limitations
  • Odd form & smart nozzle banks 
  • 65,000CPH Max

Technical Data

  • 01005 to 99 x 99 mm components
  • PCB size up to 2059mm x 715mm
  • Component weight & height – 300g & 34mm